MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, innovatively launches a quantum-enhanced deep convolutional neural network image 3D reconstruction ...

Engineers in the United States have developed a novel multilayer computer chip with a unique architecture that could help ...

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...

Researchers have demonstrated the first chip-based 3D printer, a tiny device that emits reconfigurable beams of visible light into a well of resin that rapidly cures into a solid shape. The advance ...

A research team at UT Austin has introduced a new technique that could redefine how semiconductor components are designed and ...

The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...

Taiwan Semiconductor Manufacturing Co. is vying with Intel to become the first company to sell three-dimensional chips that boost the density of transistors in a single semiconductor by up to 1000 ...

Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the cost ...

Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...

Why co-optimization is needed when designing 2.5D and 3D chips. The tools provided by Siemens for 2.5D and 3D chip design and packaging. The latest high-performance chips often employ 2.5D and 3D chip ...

Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...