Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...
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US engineers develop 3D chip that offers order-of-magnitude speed gains, accelerates AI
Engineers in the United States have developed a novel multilayer computer chip with a unique architecture that could help ...
MicroCloud Hologram Inc. (NASDAQ: HOLO), ("HOLO" or the "Company"), a technology service provider, innovatively launches a quantum-enhanced deep convolutional neural network image 3D reconstruction ...
Researchers have demonstrated the first chip-based 3D printer, a tiny device that emits reconfigurable beams of visible light into a well of resin that rapidly cures into a solid shape. The advance ...
Researchers have invented a new way to align 3D semiconductor chips by shining a laser through concentric metalenses patterned on the chips to produce a hologram. Their work can help to lower the cost ...
A research team at UT Austin has introduced a new technique that could redefine how semiconductor components are designed and ...
Traditional chip scaling is reaching its limits, prompting the industry to explore new advancements like 3D chip packaging. Intel has repositioned its foundry from a supportive role to a strategic ...
The advantages of 3D digital twins when it comes to building chiplet-based designs. The power-, heat-, and noise-related challenges that chiplets present to engineers. New capabilities of Ansys’s ...
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