Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at terabits per second speeds, but manufacturing challenges remain regarding ...

(Nanowerk News) Researchers from SEMATECH's 3D Interconnect program based at the College of Nanoscale Science and Engineering's (CNSE) Albany NanoTech Complex have reported advances in wafer-to-wafer ...