Amkor's S-SWIFT packaging technology addresses advanced IC packaging challenges through an embedded trace RDL process, providing higher bandwidth die-to-die interconnects for AI, HPC, and data center ...
Copper (Cu) redistribution layer (RDL) technology is used to interconnect chips in various high current Wafer Level Packaging (WLP) applications. Typically, Cu RDLs with thicknesses of 5-9 µm and ...
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