SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it is collaborating with TSMC to enhance productivity and optimize product performance for AI-driven ...
Taiwan Semiconductor Manufacturing Co. (TSMC) today released what it believes is the first manufacturability-focused IC design flow that is silicon-proven in its 0.25-micron and 0.18-micron ...
Sunnyvale, Calif. To some engineers, “methodology” simply means a general approach to design. To others, it suggests a specific sequence of events, perhaps even a specific sequence of particular tools ...
Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
The semiconductor industry has come a long way since integrated circuits (ICs) were designed using a pen and heaps of graph paper. Modern chip architects make heavy use of electronic design automation ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has sh ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a collaboration with GlobalFoundries (GF) aimed at speeding silicon photonics IC development for 5G ...
IROC Technologies faced developing an integrated circuit (IC) - from scratch - with limited internal IC design resources. To meet the aggressive tapeout schedule, IROC needed to feel confident in the ...
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