The new LIN SiP is based on Atmel’s second-generation LIN IP with excellent EMC and ESD performance. It is optimized for low-cost LIN slave applications and enables system cost reductions of up to 25% ...

System integration is increasingly being done using 3D packaging technologies rather than integrating everything onto a huge SoC. One motivation is the ability to not just to split up a design in a ...

The current trend in the electronics market is to seek solutions with ever-higher levels of integration at an ever lower cost. In this context, the System in Package (SiP) represents the ideal ...

The previous articles of this series have discussed the innovation and evolution of the integrated-circuit industry and how system-in-package (SiP) devices fit into the market. In the first article, ...

System-in-package (SiP) is quickly emerging as the package option of choice for a growing number of applications and markets, setting off a frenzy of activity around new materials, methodologies, and ...

The rapid evolution of heterogeneous integration and packaging technologies is reshaping the landscape of electronic design by enabling the assembly of diverse, specialised chip components into ...

Apple's third-generation AirPods will adopt a compact system-in-package (SiP) solution similar to AirPods Pro, according to the latest research note from TF International Securities analyst Ming-Chi ...

The semiconductor industry is moving out of the monolithic age of the system-on-chip (SoC). Instead of arranging every building block of IP on the same slab of silicon, the movers and shakers in the ...