Electronic Design

OSCI Proposes Extensions To TLM Standard

The Open SystemC Initiative (OSCI) has delivered its Draft SystemC Transaction-Level Modeling (TLM) 2.0 kit, containing proposed extensions to OSCI TLM application programming interface (API) ...
Design-Reuse

Open SystemC Initiative Announces Proposal for Significant Extensions to Transaction-Level Modeling (TLM) Standard

Milestone Release of Draft TLM 2.0 Kit for Public Review Promotes Interoperability San Jose, Calif. and Grenoble, France (at the ECSI TLM Workshop) – December 4, 2006 – The Open SystemC Initiative ...
Design-Reuse

Design & Verify Virtual Platform with reusable TLM 2.0

As the system, software & IP complexity is increasing so is the demand of SystemC models & Virtual Platform for verification. To achieve it, the key requirements are that the models/platform should be ...
EDN

Defining the TLM-to-RTL Design Flow

As System-on-Chip (SoC) designs grow ever larger, design and verification flows are changing. A rich mix of features, increased software content, high intellectual property (IP) use and submicron ...