Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed gains.

TSMC has recently announced SoIC-P, microbump versions of its System on Integrated Chips (SoIC) solutions providing a cost-effective way for 3D chip stacking. TSMC said SoIC-P complements its existing ...

Say you wanted to create a chip in which a processor fabricated in 32-nm process rules would be combined with memory done on a 65-nm process and analog blocks fabricated at 180 nm. This leads you to ...

Bernin (France), June 3, 2025 – Soitec (Euronext – Tech Leaders), a world leader in the design and production of innovative semiconductor materials, today announced a strategic collaboration with ...

The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...

Hybrid, 3D integrated optical transceiver. (A,B) The test setup: the photonic chip (PIC) is placed on a circuit board (green), and the electronic chip (EIC) is bonded on top of the photonic chip. (C) ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...