Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...

Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

Public records clearly shows that for the past 25 years, CERN has repeatedly built inadequate FPGA-based Level-1 Triggers, necessitating multiple rebuilds. During the Higgs boson discovery ...

Abstract: The LLM decoding process poses a significant challenge for memory bandwidth due to its autoregressive nature. Prior 2D memory solutions fail to overcome this memory bottleneck due to limited ...

The chips that datacenters use to run the latest AI breakthroughs generate much more heat than previous generations of silicon. Anybody whose phone or laptop has overheated knows that electronics ...

To test the new chips, the researchers used a special machine, like the one pictured here, to perform automated electrical characterization of the designs on a wafer of chips.Bella Ciervo, Penn ...

ASML CEO Christophe Fouquet says lithography stays central as chipmakers build more powerful artificial intelligence chips. • ASML Holding stock is showing weakness. Why is ASML stock retreating?

Engineers at Carnegie Mellon University, Stanford University, University of Pennsylvania, and the Massachusetts Institute of Technology have collaborated with SkyWater Technology, the largest ...

Reaching the College Football Playoff -- even in the current 12-team era -- is extremely difficult. So it's no surprise that the coaching quality among this year's CFP contenders is top-notch, and ...