Abstract: As Moore's law fades and scaling of logic, memory and interconnects diverge, 3D integration technologies have become one of the primary approaches to maintaining performance gains in SoCs ...
For our latest podcast, we look back at the year that was. We used to argue whether design was about aesthetics or about ...
Abstract: As chiplets containing multiple diverse functional dies are integrated into a single package, the demand for advanced packages with higher density interconnects and larger footprint body ...
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