Despite the Commodore 64 having been out of production for probably longer than many Hackaday readers have been alive, its ...

Fuji Electric has announced an agreement with Robert Bosch GmbH to collaborate on SiC power semiconductor modules for ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

The Global Semiconductor Advanced Substrate Market was valued at USD 9293 Million in the year 2024 and is projected to reach a revised size of USD 14630 Million by 2031, growing at a CAGR of 6.8% ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

Why a self-contained “LED effects” manager may be a good system-wide design option. The many actions that this LED driver can initiate while offloading the processor. How a new evaluation module helps ...

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple ...

TSMC is set to begin mass production of its 2nm process by the end of this year, with Apple already securing more than half of the 2026 capacity for the iPhone 18 series’ A20/A20 Pro processors, ...

If you're planning to have a cutting-edge chip manufactured in late 2025 or early 2026, you're probably looking at TSMC, because the only other company operating a fab at a similar node is Intel, and ...