Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Abstract: This paper presents a novel Phase-Locked Loop (PLL) system that operates in the frequency range of 4-8 GHz. By utilizing System in Package (SiP) technology, the system is highly compact, ...
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