Artificial intelligence has raced ahead so quickly that the bottleneck is no longer how many operations a chip can perform, ...

As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...

Public records clearly shows that for the past 25 years, CERN has repeatedly built inadequate FPGA-based Level-1 Triggers, necessitating multiple rebuilds. During the Higgs boson discovery ...

A groundbreaking team from Stanford, MIT, CMU, Penn, and SkyWater Technology has just built the first-ever monolithic 3D chip ...

Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...

Researchers have created a new kind of 3D computer chip that stacks memory and computing elements vertically, dramatically ...

A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring and order-of-magnitude speed gains.

China is stepping up its chip self-sufficiency push by combining relatively mature chips with new computing architectures in an effort to approach Nvidia’s performance levels, according to a top ...

Scientists say they've developed a breakthrough 3D wiring solution that allows a 100-fold increase in the number of quantum bits (qubits) a quantum computing chip can support. The new architecture, ...

Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.

CEA-Leti has announced a major advance in semiconductor manufacturing, successfully fabricating fully functional 2.5 V SOI CMOS devices at just 400 °C. Low-temperature CMOS breakthrough Credit: ...